System and method for implementing wiring changes in a solderless printed wiring board module
US5298686A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1990 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Oct 23, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10719
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Both a system and method is provided for implementing a wiring change with respect to an electrical component detachably connected to a solderless PWB module. The system comprises at least one unused via on the PWB, an insulator used for electrically disconnecting a selected contact pad of the component from a contact pad disposed on the PWB, and a metallic strip mounted on a substrate for electrically connecting the selected component contact pad to the unused via. In one embodiment of the system, the substrate used to support the conductive strip is the compliant, insulative sheet material used in the interface that normally interconnects the pads of the electrical component with the pads of the PWB module. Alternatively, a separate "smart" layer formed from a thin insulative sheet material may be used to support the conductive strip. The "smart" layer has an array of conductive regions disposed through its thickness which maintains the contact between the pads of the PWB and the pads of the electrical component. However, when a change is desired, these conductive areas may be abraded off, and a copper strip connector may be provided on the surface of the "smart" layer between th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.