Leadless chip-type light emitting element
US5298768A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1992 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Dec 30, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting element having a cavity at the center of the top surface of an insulating block body. A through-hole extends downward through the block body to the bottom of the cavity. A metallic layer is present on the sides and bottom of the cavity, the sides of the through-hole, the bottom surface and part of the side surfaces of the block body. An LED chip is disposed on the metallic layer to the side of the bottom of the cavity. The LED chip and the metallic layer formed on a side of the bottom of the cavity separate from the first side are connected by a metallic wire. The cavity and the through-hole are filled with resin for encapsulating the LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.