Method for investigating ground structure of pavement
US5298987A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N7/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method for investigating the ground structure of a paved road which requires only a small diameter boring for direct observation of the ground structure. The method comprises a step of boring an investigation hole with a small diameter which reaches at least a sand layer of a roadbed, penetrating a paved floor of said paved road, a step of cleaning an inside of said investigation hole which is bored by said boring step, a step of photographing in said investigation hole which has been cleaned by said cleaning step, said photographing step photographing an overall surface of an inner circumferential wall of said investigation hole by means of image pickup means, a step of sending this image to a warping microprocessor, a step of recording said photograph data in recording means, and a step of filling up said investigation hole after said photographing step is finished to repair the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.