Polishing material
US5300130A · kind A · utility
103Cited by
3References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 26, 1993 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Jul 26, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A novel polishing slurry for particularly hard materials such a silicon carbide has been found. The slurry comprises diamond particles with a median particle size of around a micron and alpha alumina particles with a median size of from about 20 to about 200 nanometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.