Hydroprimer for metallising substrate surfaces
US5300140A · kind A · utility
11Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1992 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Feb 27, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/387
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Formulations which contain a water-dispersible polymer, a metallization catalyst, if appropriate fillers, if appropriate other constituents and water are outstandingly suitable for the pretreatment of various substrate surfaces for the purpose of subsequent metallization in a currentless metallization bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.