Patent · US Expired

Hydroprimer for metallising substrate surfaces

US5300140A · kind A · utility

11Cited by
2References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 27, 1992
Grant dateApr 5, 1994
Priority date
Expiry dateFeb 27, 2012

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K3/387
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

Formulations which contain a water-dispersible polymer, a metallization catalyst, if appropriate fillers, if appropriate other constituents and water are outstandingly suitable for the pretreatment of various substrate surfaces for the purpose of subsequent metallization in a currentless metallization bath.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.