Protective coating having adhesion improving characteristics
US5300158A · kind A · utility
12Cited by
21References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1992 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | May 26, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a method of treating a copper or copper alloy substrate to provide improved resistance to both oxidation and to chemical attack. The substrate is immersed in an aqueous solution containing both chromium (VI) ion and phosphate ions. The treatment is particularly effective for protecting imaged printed circuit boards during storage, handling and use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.