Surface-protection method during etching
US5300172A · kind A · utility
13Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1992 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Oct 29, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/948
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is disclosed a surface-protection method during chemical etching of a plate material, which comprises sticking a radiation-curable adhesive tape onto the area of plate material where etching should not be effected, and after the radiation-curable adhesive layer is cured with irradiation of radiation, subjecting said plate material to a chemical etching treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.