Method for mounting a wafer to a submount
US5300175A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 1993 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Jan 4, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/012
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor wafer (40) is placed in a first pressure chamber (37) of a bonding apparatus (10 or 60). A major surface (46) of a submount (44) is placed on a submount support (30 or 62). The major surface (46) of the submount (44) seals the first pressure chamber (37). A pressure differential is generated between the first pressure chamber (37) and a second pressure chamber (47) The pressure differential bows a central portion of the submount (44) toward the semiconductor wafer (40). The central portion of the submount (44) contacts an adhesive coating over a central portion of the semiconductor wafer (40). The submount support (30 or 62) is displaced to decrease a curvature on the submount (44). The pressure differential is increased to an end-point to facilitate bond formation between the semiconductor wafer (40) and the submount (44).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.