Plasma surface treatment method and apparatus
US5300189A · kind A · utility
27Cited by
4References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 1987 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | May 20, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2037/90
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A surface treatment method and apparatus permitting the treatment of a film with plasma with a high treatment speed and a high efficiency without uselessly complicating the construction of a device for realizing it are disclosed. The area where the counter electrode is in contact with the plasma is sufficiently larger than the area where the rotating electrode is in contact therewith. The ratio of the areas is preferably not smaller than 1.5 and the etching speed may be increased to a value more than ten times as great as that obtained by a prior art method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.