Method for determining thickness of chemical vapor deposited layers
US5300313A · kind A · utility
3Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1992 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Dec 16, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/045
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The thickness of a layer of material deposited by chemical vapor deposition, especially a diamond layer, is monitored by providing at least one substrate on which the material is deposited, with at least one perforation of a predetermined size therein. The relationship between the thickness of the layer formed in said perforation and the thickness of the layer formed on the substrate surface is determined, so that the thickness of the surface layer can be determined from the thickness of the layer formed in the perforation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.