Process for the production of relief structures using a negative photoresist based on polyphenols and epoxy compounds or vinyl ethers
US5300380A · kind A · utility
8Cited by
26References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1992 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Sep 17, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0388
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a negative photoresist consisting essentially of a process for the production of relief structures using PA0 a) at least one solid film-forming polyphenol, PA0 b) at least one compound which contains at least two epoxide groups or at least two vinyl ether groups or at least one epoxide and vinyl ether group in the molecule, PA0 c) at least one cationic photoinitiator for component b) and PA0 d) if appropriate customary additives. The resist can be developed under aqueous-alkaline conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.