Method for producing semiconductor device
US5300453A · kind A · utility
4Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1993 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Mar 10, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/062
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a semiconductor device, is composed of steps of: covering a lower side of a semiconductor wafer with a heavy metal and disposing the semiconductor wafer in a chamber; causing the heavy metal to diffuse into the semiconductor wafer by heating the semiconductor wafer with a heat source having a small thermal capacity; and thereafter, ceasing to heat with the heat source, then charging the chamber with a cooling gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.