Method and device for the insertion of chips into housings in a substrate by an intermediate film
US5300457A · kind A · utility
2Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1992 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Feb 4, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for the insertion of chips into housings let into a substrate especially of the hybrid type, consisting, before fixing the chips (1a) into the abovementioned housings (2a), in holding the chips (1a) respectively in the abovementioned housings (2a) by the agency of a film (6) which is bonded to one of the faces of the substrate (3) and to which are bonded the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.