Lignin modified binding agents
US5300593A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 1993 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Aug 17, 2013 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16D69/025
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A binding agent for molding compositions and molded bodies produced by reacting a low molecular weight lignin from the Organosolv process with phenol in a weight ratio of 1:20 to 3:1 at 100.degree. to 180.degree. C., adjusting the pH to an acidic value and condensing the mixture with 0.2 to 0.9 moles of formaldehyde per mole of phenol at 60.degree. to 120.degree. C. to form the binding agent useful for producing curable molding compositions, high-temperature molding compositions, refractory products, textile fleeces and friction coatings as well as carbon materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.