Method for severing integrated-circuit connection paths by a phase-plate-adjusted laser beam
US5300756A · kind A · utility
62Cited by
16References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 22, 1991 |
| Grant date | Apr 5, 1994 |
| Priority date | — |
| Expiry date | Oct 22, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for severing integrated-circuit conductive links by laser power employs a phase plate (26) to shape the laser beam's intensity profile. The profile thus imparted to the beam approximates the Fourier transform of the intensity profile desired on the workpiece (34). As a consequence, when a focusing lens (32) receives a beam having the profile imparted by the phase plate (26), it focuses that beam into a spot on the workpiece (34) having an intensity profile more desirable than the ordinary Gaussian laser-beam profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.