Transparent thermoplastic molding compound and use thereof

US5301254A · kind A · utility

Assignee

• Hoechst GmbH · DE

Inventors

• Peter Blickle · Hofheim, DE
• Jochen Coutandin · Bretzenheim, DE
• Peter Herbrechtsmeier · Königstein, DE
• Klaus Hintzer · Woodbury, US
• Gerhard Wieners · Frankfurt am Main, DE

Key dates

• Filing date: Nov 7, 1991
• Grant date: Apr 5, 1994
• Expiry date: Nov 7, 2011

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B1/045
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A transparent thermoplastic molding compound consisting of 40 to 90% by weight of units derived from tetrafluoroethylene, and 60 to 10% by weight of units derived from compounds of formula I or II: EQU CF.sub.2 .dbd.CF--O--(CF.sub.2 --CF(CF.sub.3)--O).sub.m --(CF.sub.2).sub.n --CF.sub.3 (I) EQU CF.sub.2 .dbd.CF--O--(CF.sub.2 --CF(CF.sub.3)--O).sub.p --(CF.sub.2).sub.q --COO--R (II) is particularly suitable for manufacturing the sheath of beam waveguides whose core has a higher transparency than polymethyl methacrylate.