Single atmosphere for firing compatible thick film material
US5302412A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 1992 |
| Grant date | Apr 12, 1994 |
| Priority date | — |
| Expiry date | May 14, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4867
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an improved method for firing thick film inks in hybrid circuits which comprises firing different copper compatible thick film materials in a single firing atmosphere. The method comprises the steps of providing a paste suitable for application to a ceramic substrate, applying the paste to the substrate by a conventional technique such as screen printing, drying the substrate, and firing the substrate at an elevated temperature in an ambient comprising an inert gas and carbon dioxide to form the electrical component. In another embodiment, the substrate is fired in an ambient comprising only carbon dioxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.