Multi-layer wraparound heat shrink sleeve
US5302428A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1992 |
| Grant date | Apr 12, 1994 |
| Priority date | — |
| Expiry date | Sep 29, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2826
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A multiple layer wraparound sleeve having a heat shrinkable backing layer and at least one functional layer has the functional layer as a discrete sheet which is connected to one end of the backing layer, and is of at least sufficient length that, when the sleeve is wrapped around the pipe or other substrate at least twice, the functional layer sheet wraps around the substrate first with its ends overlapping and the backing layer wraps around the functional layer sheet with its ends overlapping. This allows wrappings of reduced thickness to be employed without problems of voids occurring between the functional layer and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.