Method of manufacturing printing circuit boards
US5302492A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 1993 |
| Grant date | Apr 12, 1994 |
| Priority date | — |
| Expiry date | May 24, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0789
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing printed circuit boards is disclosed wherein metallic conductive structures are produced in a desired pattern on a carrier board of isolating material. The method begins with the provision of a carrier board having a metal foil laminated to its surface and thereafter forming conductive traces on the carrier board, deactivating the carrier board to remove substantially all substances deposited on the carrier board other than the conductive traces and forming final conductive structures by electroless chemical metal deposition on the pattern of conductive traces. Circuit boards manufactured in accordance with such a method will have final conductor structures with base layer portions of the original laminated metal foil. In a preferred embodiment, the step of deactivating the carrier board involves rinsing the carrier board with hydrochloric acid. The method can be used for manufacturing single-layer or multilayer printed circuit boards with or without through-holes and permits the formation of conductor structures in the range of 50 micrometers or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.