Land grid array package
US5302853A · kind A · utility
72Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1993 |
| Grant date | Apr 12, 1994 |
| Priority date | — |
| Expiry date | Jan 25, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A combination heat sink (18, 41, 43) and circuit interface comprises a metallic wafer (15) disposed between an integrated circuit (11) and a printed circuit board (14) in a land grid array package (10). A frame (13) for the integrated circuit (11) is nested within the heat sink (18, 41, 43) and a latch (30) is pivotably mounted on the frame (13) for retaining the overall package (10). The circuit interface comprises a plurality of flexible electrical connectors (19) mounted on the wafer (15).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.