Packaging structure of a semiconductor device
US5302854A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1991 |
| Grant date | Apr 12, 1994 |
| Priority date | — |
| Expiry date | Oct 18, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention comprises the steps of electrically connecting at least one pair of bumps on a semiconductor device, bringing the bumps into contact with a surface of the packaging substrate and moving the semiconductor device relative to the packaging substrate while monitoring whether at least one pair of electrode terminals formed on the surface of the packaging substrate are electrically connected to each other, positioning the semiconductor device with respect to the packaging substrate at a position where the electrode terminals whose electrical connection is monitored are electrically connected to each other, and packaging the semiconductor electrode on the packaging substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.