Solder preform carrier and use
US5303824A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 4, 1992 |
| Grant date | Apr 19, 1994 |
| Priority date | — |
| Expiry date | Dec 4, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S206/821
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Clear thermoplastic is vacuum molded to produce rectangular, frustro-pyramidal shaped cavities in a horizontal matrix for holding rectangular solder preforms. No-clean flux liquid is dispensed onto a preform placed in each cavity, then another holder is placed upside-down on the first holder, the holders are flipped and then no-clean flux liquid is dispensed on the dry side of the preform. Holes in the cavity bottoms drain and circulate drying air to the preform bottoms. A hole in one corner and a different width slot in an opposite corner of each holder, allow multiple holders to be stacked on a bottom frame with different sized threaded posts. An empty holder and then a dust cover are stacked on the posts to hold and protect the preforms. A top frame is stacked on the posts and nuts are screwed onto the posts to form a carrier. The cavities are sized relative to the preforms to hold the preforms in position during carrier transport. The holders are unstacked and each positioned at a station with different sized posts on a rotating table of a pick-and-place machine. A robot arm with rubber tipped vacuum probe picks up the preforms and places them on a circuit board. Grippers on th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.