Binder mixture
US5304225A · kind A · utility
11Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1991 |
| Grant date | Apr 19, 1994 |
| Priority date | — |
| Expiry date | Oct 25, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B35/524
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Mixtures consisting of a phenolic resin, a hardener, and residues from bisphenol-A production in the ratio of 1:9 to 9:1 are used for the production of binder mixtures for thermostable molding materials. Usable for said purpose are binders with a minimum content of phenolic resin of 10%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.