Low friction polyamide, polyethylene, P.T.F.E. resin
US5304422A · kind A · utility
16Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1990 |
| Grant date | Apr 19, 1994 |
| Priority date | — |
| Expiry date | Sep 19, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide resin composition comprising: (a) 100 parts by weight of a polyamide; (b) from about 1 part to about 80 parts by weight of an aromatic polyamide fiber; (c) from about 3 parts to about 80 parts by weight of a polytetrafluoroethylene; and (d) from about 1 part to about 20 parts by weight of high-density polyethylene is disclosed. The polyamide resin composition can be molded into sliding members, like bearings, bushings and slide rails, that demonstrate excellent mechanical and physical properties, like low frictional force, low self-abrasion, and low abrasion to metals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.