Copper foil for printed circuit boards
US5304428A · kind A · utility
4Cited by
5References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 2, 1993 |
| Grant date | Apr 19, 1994 |
| Priority date | — |
| Expiry date | Feb 2, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of surface treatment of a copper foil for printed circuit boards comprising the steps of forming a treating layer of copper-zinc or copper-zinc-nickel by electrolysing at least a side of a copper foil in a manner of cathodic electrolysis in a bath of copper-zinc including copper ion, zinc ion, tartaric acid and alkali or further including nickel ion, and giving a chromate treatment to the copper foil. A copper foil for printed circuit boards obtained by using a copper-zinc-nickel bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.