Multilayer IC semiconductor package
US5304743A · kind A · utility
49Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 1992 |
| Grant date | Apr 19, 1994 |
| Priority date | — |
| Expiry date | May 12, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved multilayer integrated circuit package. The package, which has a plurality of layers of conducting leads, has metal vias which connects leads in a first layer connected to leads in a second layer. The improvement comprises having at least one of the vias with a cross-section such that the via is much larger in a first direction than in a second direction generally perpendicular to said first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.