Power carrier with selective thermal performance
US5305186A · kind A · utility
27Cited by
24References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1993 |
| Grant date | Apr 19, 1994 |
| Priority date | — |
| Expiry date | Jan 27, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic package comprising a circuit carrier having a power chip, an integrated circuit means, and thermal conduction means for carrying heat from the microelectronic package is provided. The thermal conduction means includes a first heat dissipation back plate means associated with the power chip and a second heat dissipation back plate means associated with the integrated circuit means. The heat dissipation back plate means are electrically isolated from each other and have different heat dissipation capacity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.