Method of direct transferring of electrically conductive elements into a substrate
US5305523A · kind A · utility
13Cited by
13References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 24, 1992 |
| Grant date | Apr 26, 1994 |
| Priority date | — |
| Expiry date | Dec 24, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for forming one or more electrical conductors in a multilayer structure such as a computer component during a punching operation. A conducting sheet is placed in direct contact with a sheet of a deformable dielectric material. A punch is used to form a conducting slug from the sheet and to simultaneously transfer the slug into the dielectric material. During the transfer operation, a portion of the dielectric material is displaced so as to cause a mechanical interference between the slug and dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.