Moisture control in vibratory mass finishing systems
US5305554A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1993 |
| Grant date | Apr 26, 1994 |
| Priority date | — |
| Expiry date | Jun 16, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B31/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A "closed-loop" moisture control system for use in vibratory mass finishing systems. A substantially constant amount of a grinding and/or polishing slurry is maintained in a finishing reservoir of the vibratory mass finishing system by controlling the amount of such fluid flowing from a supply reservoir into the finishing reservoir, and/or the amount of such fluid flowing from the finishing reservoir into a collection reservoir. In operation, a total weight of the supply reservoir and its contents, and of the collection reservoir and its contents is monitored and, in the event there is an increase in the total weight, a control means increases the amount of polishing fluid flowing from the supply reservoir into the finishing reservoir, and/or decreases the amount of polishing fluid flowing from the finishing reservoir into the collection reservoir. Conversely, in the event there is a decrease in the total weight, the control means decreases the amount of polishing fluid flowing from the supply reservoir into the finishing reservoir, and/or increases the amount of polishing fluid flowing from the finishing reservoir into the collection reservoir.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.