Resinless pseudoplastic bonding compositions
US5306333A · kind A · utility
32Cited by
8References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 8, 1993 |
| Grant date | Apr 26, 1994 |
| Priority date | — |
| Expiry date | Jan 8, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An alternative vehicle system which utilizes no resin for depositing an inorganic material onto a substrate. The vehicle system consists of mixtures of solvents having high intrinsic viscosity and good wetability providing a pseudoplastic rheology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.