Method of protecting aluminum nitride circuit substrates during electroless plating using a surface oxidation treatment
US5306389A · kind A · utility
1Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1991 |
| Grant date | Apr 26, 1994 |
| Priority date | — |
| Expiry date | Sep 4, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/09
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for protecting aluminum nitride circuit substrates during electroless plating using surface oxidation. The aluminum nitride substrate is coated with a metal stack. The coating on the substrate is etched to form a circuit pattern. The patterned substrate is then fired in an oxidizing atmosphere at a temperature and time sufficient to convert the exposed aluminum nitride to aluminum oxide. After this conversion, the substrate is plated in an electroless solution forming a microwave circuit ready for component attachment and packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.