Method and apparatus for coating substrates
US5306407A · kind A · utility
75Cited by
4References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1992 |
| Grant date | Apr 26, 1994 |
| Priority date | — |
| Expiry date | Jul 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32055
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and an apparatus for coating substrates is described in which the layer to be applied is produced by the condensing particles of a plasma generated by a gas discharge which are incident on the substrates. Both an arc discharge vaporization coating process and a cathode sputtering coating process are effected in the same apparatus, and the arc discharge vaporization process is carried out before the cathode sputtering process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.