Mold closure system
US5306564A · kind A · utility
8Cited by
10References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 11, 1993 |
| Grant date | Apr 26, 1994 |
| Priority date | — |
| Expiry date | Feb 11, 2013 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16F1/041
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There is disclosed a spring-loaded shock absorbing system for use with molding devices to minimize wear due to repeated closing of mold portions. A helical spring which separates the mold portions must be overcome to join the mold portions. The spring is compressed between a platform's shoulder surface of adjustable height and a ledge flaring outward from a spring retainer. The shock absorber is used in conjunction with a clamping system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.