Structures for electrically conductive decals filled with organic insulator material
US5306872A · kind A · utility
13Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1992 |
| Grant date | Apr 26, 1994 |
| Priority date | — |
| Expiry date | Dec 23, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4614
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to new decal structures, and more particularly to electrically conductive decals that are filled with organic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with organic dielectric materials are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.