Semiconductor device and semiconductor module having auxiliary high power supplying terminals
US5306948A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1992 |
| Grant date | Apr 26, 1994 |
| Priority date | — |
| Expiry date | Sep 24, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Herein disclosed is a chip-carrier type semiconductor device adopting the MCC structure, in which a semiconductor pellet is mounted on the surface of the base substrate and in which mounting terminals to be connected with external terminals of the semiconductor pellet are mounted on the rear surface of the base substrate. In order to effect a test such as screening easily and inexpensively even if the mounting terminals are multiplied or miniaturized, the chip-carrier type semiconductor device adopting the MCC structure is equipped on the side surfaces of the base substrate with auxiliary terminals to be electrically connected with a plurality of external terminals which are arrayed on an element formed main surface of the semiconductor pellet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.