Heatsink for contact with multiple electronic components mounted on a circuit board
US5307236A · kind A · utility
46Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 1992 |
| Grant date | Apr 26, 1994 |
| Priority date | — |
| Expiry date | Jul 22, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heatsink to remove heat dissipated by electronic components mounted on a circuit board comprises a thermally conductive material plate disposed over the components and attached by fixing mean near each component. The plate comprises spherical deformations facing the components and each deformation is in thermal contact with the heat source of a respective component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.