Method of manufacturing a chip inductor with ceramic enclosure
US5307557A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 14, 1992 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | Apr 14, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49071
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip inductor is provided and a ceramic enclosure is formed with a central bore therein by means of known powder metallurgy techniques. The ceramic powders are bonded with a suitable bonder, such as polyvinyl alcohol (PVA), to form particles of a suitable size. The particles are then compacted and pressed by, for example, a hydraulic device to form a desired shape and then sintered and 1,300 to 1,500 degrees Celsius. Thereafter, terminals for external connection, which has three layers of different metals and/or alloys, such as silver, nickel and the alloy of tin and lead, are formed on suitable locations of the ceramic enclosure. The naked chip inductor is disposed inside the central bore of the ceramic enclosure and soldered to the pre-formed terminals. The final phase of the manufacturing process is to seal the openings of the central bore of the ceramic enclosure with resin, such as epoxy resin or acrylic resin. A ceramic chip inductor is formed with a ceramic shield and since no high temperature process is involved, the physic property of the chip inductor is maintained constant during the manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.