High density interconnection system
US5308248A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1992 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | Aug 31, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/721
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A daughter card is provided with an insertion portion, including a row of contact pads on each side of an edge prepared for insertion into the slot of card edge connector, and a contact structure extending from one or both sides of the card. Contact terminals of the contact structure extend parallel to the insertion portion of the card, being electrically connected to circuits within the card. On a mother board, a connector is provided with a first slot for removably receiving the insertion portion of the daughter card, and with one or two slots for removably receiving the contact terminals. The mother board and the daughter card include essential circuits, which are connected through the contact pads, and non-essential circuits, which are connected through the contact terminals. The daughter card may be plugged into a standard type of card edge connector, having only a single, central card-receiving slot, with the contact terminals extending outside the outer surfaces of the connector. A standard type of daughter card, with contact pads on an insertion portion but without the contact terminals extending outward from the card, can be plugged into the first slot of the connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.