Preparation of a firm bond between copper layers and aluminum oxide ceramic without use of coupling agents

US5308463A · kind A · utility

Assignee

• Hoechst GmbH · DE

Inventors

• Bernhard Hoffmann · Starnberg, DE
• Hartwig Gernoth · Viernheim, DE

Key dates

• Filing date: Sep 11, 1992
• Grant date: May 3, 1994
• Expiry date: Sep 11, 2012

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C14/18
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A process for preparing a firm bond between copper layers and aluminum oxide ceramic without coupling agent layers wherein the aluminum oxide ceramic is subjected to a plasma etching process in a first vacuum chamber in the presence of oxygen and immediately thereafter plated with copper by sputtering in a second vacuum chamber.