Low temperature tin-bismuth electroplating system
US5308464A · kind A · utility
4Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1993 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | Feb 23, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/13
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.