Method and apparatus for through hole substrate printing
US5308645A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 1992 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | Aug 7, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an apparatus and method of through hole substrate printing wherein the apparatus includes a nest plate having a plurality of vacuum source holes formed therein of a size substantially greater than the through holes in the substrate, and a plurality of removable pointed pins supporting the substrate in a substantially flat and horizontal position during the printing operation. The removably pointed pins allow for the flexibility of printing a variety of conductive patterns for different substrates and without the risk of breaking the substrate or smearing the conductive pattern on the bottom surface of the substrate or the subsequent substrate to be printed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.