Apparatus for heating and controlling temperature in an integrated circuit chip
US5309090A · kind A · utility
66Cited by
8References
4Claims
0Family size
Inventor
Key dates
| Filing date | Sep 6, 1990 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | Sep 6, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and an apparatus to heat an integrated circuit and regulate its temperature for the purposes of burn-in and temperature testing are provided. The circuit is heated internally by integrating a heating means. Sensing and controlling means may also be integrated. Such heating and controlling are activated by external signals applied to the IC. Practical means to heat the integrated circuit with pre-existing components is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.