Leadframe strip for semiconductor packages and method
US5309322A · kind A · utility
39Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1992 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | Oct 13, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substantially planar insulating sheet of high temperature printed circuit board material (11) is used to form a leadframe strip (18, 19, 21) for a semiconductor package (20). The leadframe strip (18, 19, 21) includes a die attach opening (12) through the insulating sheet (11). A plurality of metallized areas (13, 22, 23) on the insulating sheet (11) form bonding pads (13) and package leads (22). Conductive holes (14) electrically connect the bonding pads (13) and the package leads (22).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.