Device for interconnecting integrated circuit packages to circuit boards
US5309324A · kind A · utility
94Cited by
14References
16Claims
0Family size
Inventors
Key dates
| Filing date | Nov 26, 1991 |
| Grant date | May 3, 1994 |
| Priority date | — |
| Expiry date | Nov 26, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted onto the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.