Self clamping heat sink assembly
US5309979A · kind A · utility
35Cited by
5References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 8, 1993 |
| Grant date | May 10, 1994 |
| Priority date | — |
| Expiry date | Jun 8, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly for clamping stand-up power components to a heat sink wherein the components are mounted on a circuit board and enclosed within a housing. A spring clamp lightly clamps an electrical component to a heat sink during a soldering process. Thereafter, the housing assembly sandwiches the electrical component between the spring clamp and a heat sink; thus ensuring optimum heat dissipation from and stability of the electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.