Circuit system, a composite material for use therein, and a method of making the material
US5310520A · kind A · utility
17Cited by
15References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1993 |
| Grant date | May 10, 1994 |
| Priority date | — |
| Expiry date | Jan 29, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Discrete powder particles of copper 14 and INVAR 12 are mixed together in a container 16 and packed into a powder metal article. This article is hot vacuum degassed and vacuum sealed and then heated to temperature well below the sintering temperature of copper or INVAR. Immediately after heating the article, it is subjected to a high pressure, high strain force such as extrusion through a die thereby yielding a fully dense, strong composite material 10 with excellent combined thermal expansion and conductivity properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.