Enhancement of electromagnetic barrier properties
US5310576A · kind A · utility
2Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1992 |
| Grant date | May 10, 1994 |
| Priority date | — |
| Expiry date | Nov 9, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24999
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and structure for enhancing electromagnetic barrier properties including a substrate, a metallic layer deposited upon the substrate by vacuum metalization, and a plurality of sets of patterns microembossed upon the surface of the metallic layer for increasing the barrier properties of the structure. The plurality of sets of microembossed patterns each have a line density between about 100 and 50,000 lines per square centimeter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.