Integrated circuit micro-fabrication using dry lithographic processes
US5310624A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 31, 1992 |
| Grant date | May 10, 1994 |
| Priority date | — |
| Expiry date | Jul 31, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Dry, laser-based, lithographic techniques and systems for patterning a surface of a wafer or other substrate are disclosed. The techniques and systems are particularly adapted for automated micro-fabrication of integrated circuits on semiconductor wafers. The invention entails dry depositing a resist material on a surface of a substrate, then generating a pattern in the resist material by selectively exposing the resist material to pulsed UV laser radiation, controlling the ambient exposure of the resist material between the resist-depositing and pattern-generating steps, and, finally, transferring the pattern from the resist to the substrate or otherwise employing the pattern to transform the substrate by deposition or implantation of materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.