Hot-melt composition that have good open time and form creep-resistant bonds when applied in thin layers
US5310803A · kind A · utility
48Cited by
23References
41Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 1991 |
| Grant date | May 10, 1994 |
| Priority date | — |
| Expiry date | Dec 17, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2913
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot-melt composition comprising an ethylene/vinyl acetate copolymer, an ethylene/n-butyl acrylate copolymer, and a tackifying resin can be spread into a thin layer that has a limited open time of at least 5 seconds. The composition eventually crystallizes to form a creep-resistant bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.