Diorganosilacetylene-alt-diorganosilvinylene polymers and a process densifying porous silicon-carbide bodies
US5312649A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1993 |
| Grant date | May 17, 1994 |
| Priority date | — |
| Expiry date | Jun 8, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/60
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides linear organosilicon polymers including acetylene and vinylene moieties, and a process for their preparation. These diorganosilacetylene-alt-diorganosilvinylene linear polymers can be represented by the formula: --[--(R.sup.1)(R.sup.2)Si--C.tbd.C--(R.sup.3)(R.sup.4)Si--CH=CH--].sub.n-- , wherein n.gtoreq.2; and each R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is independently selected from the group consisting of hydrogen, halogen, alkyl, alkenyl, aryl, and aralkyl radicals. The polymers are soluble in organic solvents, air stable, and can be pulled into fibers or cast into films. They can be thermally converted into silicon carbide ceramic materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.